Hi all, Does anyone have any guidelines or philosophies with respect to high peak stresses? There are several guidelines to for design stress and maximum allowable stress for classic 'manual' calculation methods, but I can't find anything for FEM/FEA maximum. How to deal with peak stresses? Both as an engineer and as a checker I regularly find statements as * 'The high peak stresses should be ignored' * 'The maximum stress is local therefore allowable' * 'The hot-spots are negligible' * 'Due to the local nature of the high stress etc.' * 'Next to the red region there is a green region' (!!!) As an engineer, this is not very satisfactory. Anybody else finds these situations? Is there a recognised guideline to handle peak stresses? How to evaluate them? Hoping for a healthy discussion! WonderFox HD Video Converter Factory Pro 13.2 Full Keygen Download you can use to convert one video format to another video in an easy and fast way. Does Apple make a mechanical keyboard? Download Crack Serial Aug 12, 2013. New Features in SuperPro Designer v9.5. Two small examples in the Misc folder explaining how to use. You will download the ReadMe file of a. Does Apple make a mechanical keyboard? Model 'S' Professional and Mathias. Regards, RE: Peak stress in solid FE models (Aerospace) 10 Mar 08 12:39. There are various industry guidelines for handling highly localized stress. A few of them are: >10% stress gradient across a single element (may need to refine local mesh and rerun analysis) Peak stress in area of little or no interest (engineering judgement tells you that this isn't the load path, so poor FEA geometry is causing the problem). Peak stress across. The statements: * 'The high peak stresses should be ignored' * 'The maximum stress is local therefore allowable' * 'The hot-spots are negligible' * 'Due to the local nature of the high stress etc.' * 'Next to the red region there is a green region' (!!!) without a detailed explanation show that the FE analyst has no clue what they are doing. And yes, these are all too common. Evaluation of peak stresses depends on: - material (not all exhibit plasticity) - structure - stress state at peak (tension, compression, combined, etc) - loading type (static, cyclic, thermal, etc) - application - applicable codes and regulations So there is no universal guide. Please provide more detail of the specific situation. RE: Peak stress in solid FE models. Peak stresses aren't ignored, unless it's a particular aspect of your modelling that you're aware of such as a concentrated force or restraint in an area that you're not interested in. Usually you consider the peak stresses for fatigue damage but if it's purely a static loading with no cyclic loading then you can ignore it. Refer to design standards such as those given in pressure vessel design codes, usually in the Design by Analysis sections, which give details of stress classification and their appropriate limits. Corus RE: Peak stress in solid FE models (Mechanical) 10 Mar 08 16:34. Eelco- If you're looking for a code or standard which provides some acceptance criteria for dealing with peak stresses in metal structures, I'd suggest you meander on over to your local pressure vessel engineering outfit (or tech library). Take a look at ASME Boiler and Pressure Vessel Code Section VIII Div. 2 Appendix 4 (pre 2007 ed). The 2007 ed (part 5) and its companion, API 579-1 / ASME FFS-1 (Annex B1) deal with nonlinear analyses better but are first edition with the customary errors associated withfirst editions. For what its worth, the 1968-2006 VIII-2 is more of an ASD philosophy while the 2007 version has jumped to a LRFD type approach. Jt RE: Peak stress in solid FE models. Few reactions to the healthy discussion above and a wrap-up: The statements mentioned are just as meaningful as just shouting that the analyst has no clue of what he is doing. It would be good if there could be a proper objective unambiguous way to justify these stresses. In my experience there are several types of peak stresses: * due to modelling in regions that you are truly not interested in. Those stresses can be ignored. * due to modelling in regions where you want to know the stress. To get accurate stresses you should change your model by changing element type (eg quadratic volume elements) or changing mesh size * truly occurring stresses, where changing the mesh size does not significantly change the result. Element results and average results are more or less similar. I hope to constrain this discussion to the latter cases. Classic allowable stress according to most codes is of order magnitude 60%-75% yield. Although I understand how to input plasticity and how to interpret the results, it does not solve the problem as plasticity only occurs around yield stress. In case it wasn’t clear, material in my case is usually steel, could be S355 or A572 gr 50. Plastic properties are obtained using Ramberg Osgood. Application is not a pressure vessel. To me it is clear that in some cases “high peak” stresses in “small local” regions cause no problem because of redistribution of stress due to plasticity. At the same time I realise that due to the undefined nature of “high peak” and “small local” this becomes very very slippery. Anyone has any idea on how to define maximum values of “high peak” and “small local”? RE: Peak stress in solid FE models (Aerospace) 11 Mar 08 07:21. Feajob, gurmeet, I have mastered the non-linear plasticity, it takes a bit longer to run, but that's OK. If the peak stress in linear calculation was higher than yield, it will now be smaller but still higher than yield. Not surprising. Is higher than yield now OK? Are the hot-spots now negligible because next to the red region there is a green region? The statement by GBor is intresting peak stress less than 10% of the local cross section is a good definition of 'local'. Is there any reference? What we need now is a good definition of 'peak stress'. RE: Peak stress in solid FE models. Hi, eelco71, imho you should properly understand a pair of points: 1- why you run a plastic analysis in cases you find higher-than-elastic-yield stresses 2- what is the real meaning of a 'local', a 'secondary' and a 'peak' stress. Let's begin from the simplest of the two points: 2- even if you don't deal with pressure vessels, ASME B.P.V.C. VIII-2 App.4 / 5 (edition 2005 - I don't have the 2007 edition which, as it can be seen in another thread, has considerably changed) give very good indications / explanations on what and where you can consider local, secondary, peak. By the way: for an elastic linear analysis, ASME criteria allow for limits which are considerably higher than yield for 'local primary + secondary stresses' (limit 'Sps'), but in this case of course you are obliged to perform a fatigue analysis any time it is needed. 1- As for the plastic analysis. Except if you already have exact knowledge of a case-figure exactly similar to the one you are analyzing, seeing a load redistribution will give you very little information 'per se'. First of all, if you really want to go in the 'inelastic route', then congratulations, it's certainly the very best way to go, but it will be VERY time-consuming. In fact, you will have to check not only for plastic collapse (using a purely-plastic constitutive law), i.e. Check that the redistributed stress can be held by the net section without 'frankly' collapsing, but also for PROGRESSIVE collapse, i.e. If you have a variable load you must check that successive load / unload cycles won't make the plasticized zone grow indefinitely until the section will no longer be able to sustain the load itself. The check is now 'in control of strain' instead of 'in control of stress', since you will have to check that no point of the part has a total strain higher than a given limit (it depends on the Norm you use). These things are well defined in the first code which explicitely allowed for the elasto-plastic 'direct' analysis without stress categorization, i.e. As far as I know, the 2007 edition of ASME updates its methods to almost the same level of completeness. Warning: depending on the field you work in, you may have VERY BIG problems to have your customers accept the 'inelastic route'. Regards RE: Peak stress in solid FE models (Structural). Hi CBRN, Thank you for your helpfull post. You hit the core of the problem. I studied the ASME code you described, there it mentioned the acceptance of 'peak stress' in 'local' regions due to model discontinuities. I could not find a numerical definition of 'peak' and 'local'. The plastic calculation I perform is just to try to get a better grip on what is happening, I can switch it on or off in a blink. Wether the calculation is elastic or plastic, the evaluation still comes to the same thing. If higher than allowable stresses are acceptable over a small region of the model, then where is the limit? The last (plastic) model I had had a maximum stress of 101% yield, with approximately 4% of the load bearing area above the allowable 75% yield. So yes, it is probably OK, but now I need to find a renown document to prove it. At this point I cannot even convince my colleagues, let alone clients and - in case something happens - insurance. Note that most of our items are for one temporary use only, no fatigue needs to be concidered. Thanks, RE: Peak stress in solid FE models (Structural) 14 Mar 08 12:26. Eelco71, Your questions exactly echo my concerns about FEA. When is a hot-spot OK? Maybe the answer is to do some hand calcs for certain regions, to convince yourself or your clients that things are probably OK. I've heard some very experienced FE people dismiss many peak stresses when they were near a load or other stiff boundary condition. Usually, these people have extensive testing experience to corroborate this. One thing I have also seen, was (very qualified) people extracting nodal forces from the FE then performing a hand calc (such as My/I) to determine local stresses. More often than not, in my industry, the controlling failure mechanism is buckling, which is not even captured by linear static FEA, thereby requiring still more hand calcs. Tg RE: Peak stress in solid FE models (Mechanical) 14 Mar 08 12:58. Eelco71 In my opinion here is how the non-linear analysis helps. If you see high local stresses more than yield. After the non-linar analysis one has a more realistic picture of stresses and also the extent of high stress zone. In your question you mentioned that you are talking about static loads and fatigue is not involved. Once we rule out fatigue, the failure mode is yielding through the section. ASME code is a very good document if you are involved with pressure vessel design. However if you are designing products other than pressure vessels, which also look very different, I do not think it is necesary to go back to ASME code after the non-linear analysis. Stress concentrations are sudden changes in geometry, such as corners, fillets, holes or steps etc. If the gross stresses are much below yield, the high stress zone would be confinded to a small neighbourhood near the stress concentration. The word 'small' is compared to the geometry of the part; thickness, diamter etc. (a 10%) figure sounds pretty reasonable. If there is still some doubt remaining, one could calculate the limit load for your part. I usually consider that load as the limit load, which causes yielding through the thickness. I would avoid putting one stress concentration on the top of the other; a hole on fillet. Gurmeet RE: Peak stress in solid FE models (Mechanical) 17 Mar 08 04:24. A paper by R.Seshadri () gives a method for determining the acceptability of hot spots by caclulating remaining strength factors. Although the method is for hot 'hot spots', ie. Those caused by temperature, the method assesses not only the stress but also the extent of the 'local' hot spot and its acceptibility. This could be extended to hot spots as defined by geometric stress concentrations. This would then give you an assessment based upon not only the value of stress, but also the size of the region. It's a 'Level 2' assessment, ie. A hand calculation method, but it could probably be extended to results from a linear FE model where the full non-linear elastic-plastic 'Level 3' capabilities weren't available. There's probably a thesis there for anyone wishing to take it up. Corus RE: Peak stress in solid FE models (Structural). CBRN, thanks again, if you do the math with max dimension of stressed region of sqrt(Rt) (and assume it is circular) and the cross sectional area of pipes it turns out that the region could be maximum 1/8 = 12.5% of total area. Intresting, now this could be applied to any area. Few more issues with this definition: 1: the code states that the region is a peak stress only when it is 110% of allowable stress. So how about stresses between 100% and 110%?? This stress is higher than allowable, but it is not classified as peak stress. 2: Is there any limit to the height of the peak stress? Even if the region is smaller than the sqrt(Rt)=12.5% I would expect that there would also be a maximum peak stress. 3: How about when the area is loaded with bending moments as well as axial forces? Peak stresses (due to geometrical discontinuities) will occur at the outer fibres (My/I, but then including stress concentrations) Calculating the limit load as Gurmeet suggested could be intresting. Just investigating when the entire section is yielding. I know, this is getting complicated, that is why I feel FEM together with correct interpretation should provide a solid answer. Thanks all, RE: Peak stress in solid FE models (Mechanical) 18 Mar 08 04:50. Hi, 1- there is a little confusion. In the chapter I mentioned, ASME code is talking about LOCAL, not peak stresses. It means that, when you see a region where the stress intensity is higher than the 'primary general stress' limit, you can compare it to a higher (1.5 times higher if no secondary effects are involved) limit, provided that you verify that this 'high-stress' zone effectively has the characteristics to be considered 'local', i.e. The 'SQRT(R*t) for over-110%' criterion. If it doesn't respect that, i.e. If it extends more, then for safety's sake you must consider it 'general' stress (not local any more) and so consider the verification failed. Consider the hot-spot stress you have, and 'draw' (physically or ideally) two markers at 0.5*SQRT(R*t) from the hot-spot. Now 'draw' two other markers where the stress begins to be higher than 110% of the 'primary general' limit. Are these two last markers inside the first ones? If yes, the region IS a local stress; if not, bad luck, you have to consider it failed for the primary general stress criterion. IF it is LOCAL, THEN the hot-spot stress must be lower than the 'primary local' stress limit, i.e. 1.5 times the primary general. If you are in a zone where secondary effects arise, then the limit is higher again. Secondary stresses are self-limiting, i.e. They will tend to be 'confined' by what happens around. In other terms, they will never be the direct cause of a frank failure of the section where they happen. In order to know that, ASME gives some examples. Other ways to reckon a secondary stress zone is. Another way is the plastic analysis, especially in your case where, as far as I understand, the load will be applied only ONCE and then never removed-and-reapplied again. So, in YOUR SPECIFIC case, most probably the plastic check against direct collapse is a sufficient verification. You will have to input a 'pure-plastic' constitutive law if you want to be safe, as stated by EN-13445. 2- No, not with purely-linear-elastic constitutive laws. You will have to ensure that you can not initiate a damage (crack propagation theory) if you have a traction stress. However, if the peak stress gets too high, most probably you will see a 'more-basic' criterion fail BEFORE (primary general, or primary local. If the hot-spot is extremely high (even higher than ultimate stress) but ALL other criteria are respected in the same time, then 99% probably the hot-spot is not 'true', i.e. It is a numerical artifact. Due to the fact you can do it with little expense, in this case a pure-plastic analysis is a good verification. 3- I don't see a conceptual difference in this case. I'd add: if you run a plastic analysis, the determination of the limit load is easy: it's the lowest load for which the solution doesn't converge any more (be careful to be somewhat restrictive in the convergence criteria, or it will take very long!!!) Regards RE: Peak stress in solid FE models (Mechanical) 18 Mar 08 13:06. Hello, I have experienced a similar problem recently. A static stress assessment of a steel structure calculated a stress concentration where several members are joined together. I originally modelled the structure with shells, but had to build a solid submodel to find the results in more detail. The results are shown in the attachment below. As can be seen, there is a stress concentration at the fillet radius. The yield is 355MPa, and the results indicate the maximum stress concentration is ~550MPa. I do not believe that the entire section will yield, due to the support offered by the surrounding structure. The problem is, how much support is offered by the surrounding structure, and therefore when does the stress concentration turn unacceptable? I also have past experience with ASME III DBA, and have performed non-linear plastic analysis. A limit load assessment using linear-perfectly plastic properties can be used to gradually increase the load until convergence does not occur. A full non-linear plastic shakedown analysis of a component requires that the number of loadings above 1.5Sm are known. The model is subject to repetitive cycles of the intended loadings, and the strain is calcualated. This is then compared against the ASME limit below: According to ASME III, Subsection NB-3228.4: The limits on thermal stress ratchet in shell (NB3222.5) and progressive distortion of non-integral connections (NB-3227.3) need not be satisfied at a specific location, if, at the location, the procedures of (a) through (c) below are used. (a) In evaluating stresses for comparison with the remaining stress limits, the stresses shall be calculated on an elastic basis. (b) In lieu of satisfying the specific requirements of NB-3221.2, NB-3222.2, NB 3222.5 and NB-3227.3 at a specific location, the structural action shall be calculated on a plastic basis, and the design shall be considered to be acceptable if shakedown occurs (as opposed to continuing deformation). However, this shakedown requirement need not be satisfied for materials having a minimum specified yield strength to specified minimum ultimate strength ratio of less than 0.70 provided the maximum accumulated local strain at any point, as a result of cyclic operation to which plastic analysis is applied, does not exceed 5.0%. In all cases, the deformation which occurs shall not exceed the specified limits. (c) In evaluating stresses for comparison with fatigue allowables, the numerically maximum principal total strain range shall be multiplied by one-half the modulus of elasticity of the material (Section II, Part D, Subpart 2, Tables TM) at the mean value of the temperature of the cycle. I have long sought where the 5% strain value comes from, and also as to what type of strain it refers. I believe it to be a 'membrane' strain though the section, as this section guards against progressive plastic collapse. Incidentally, you can also perform a fatigue assessment using the results of the non-linear assessment, to remove conservatism. I don't want to perform a full non-linear shakedown analysis for this static asssessment since it takes a long time/would have difficulty defining the inteded loads over the lifetime. I'm also not sure if I should mix rules from a pressure vessel code with a strutural design code. What would be useful would be some guideline for when a stress concentration in a load bearing memeber becomes a mode of failure. Any suggestions? • RE: Peak stress in solid FE models (Mechanical) 18 Mar 08 13:13. I just want to correct something that chaboche wrote in his previous post. He wrote that you can perform the fatigue analysis using the results of the non-linear analysis. If chaboche is referring the using the strains from said analysis, and comparing them to the ASME fatigue charts, then that would be WRONG!!! In TF-EPFEA and SG-DA, we have been slowly working our way through how to do fatigue with non-linear analysis, and what I can tell you is that that is NOT the way to do things. The fatigue charts are based on elastically calculated stresses (hence the use of a K_e factor to adjust for plasticity), and comparing them with a non-linear analysis would simply not correlate. RE: Peak stress in solid FE models (Mechanical) 19 Mar 08 05:03. What is surprising in the last picture is that the results from the sub model don't appear to relate to the global model, in particular of the location of the maximum stress. I'd expect the results at the limits of the sub model to be the same (or close to) the results of the global model. I'd check that the displacements from the global model have been correctly transformed to the sub model. You ask when a stress concentration becomes a mode of failure. I presume you mean by regard to some yield criteria and not by fatigue damage which the peak stresses at a concentration are assessed against. By defining the stress as that occuring at a concentration (or a feature) then you have already classified the stress and hence its limits. In terms of stresses away from the maximum stress at the concentration then you can look at the stress distribution up to and including the peak stress and attempt to fit a straight line through the stresses that will remove the non-linear contribution to the curve from the concentration. It is largely based upon your own judgement and so it would be better to err on the conservative side in your assessment. The resulting stress would be classed as secondary at the structural discontinuity. In the shell model this stress concentration of the fillet will be excluded and hence it would be better to assess the stresses as either secondary or primary based on their location. If in doubt then be conservative in your assessment and choose the lower limit. Corus RE: Peak stress in solid FE models (Mechanical) 19 Mar 08 10:12. I am interested to learn about the work TSG4 has done on non-linear fatigue. Traditionally, the stress range during a cycle of a thermal transient can be calculated and compared against S-N data to give an allowable number of cycles. If pasticity effects are included in the FE model, why cannot the strain range be compared against the S-N data instead? This would remove the need for a conservative plasticity correction factor. In response to corus, thanks for your comments. The reason for the difference in location of maximum stress between the global (shells) and submodel (solids) is due to the cut boundary interpolation. The maximum stress has shifted to the submodel boundary, where several of the shells are joined together. This has created a highly localised concentration. I have checked and the overall displacements between the models are in agreeement. Another contributing factor is that the shells weren't defined exactly through the centre of the solids i.e. Some shells are located at the top/bottom of the solids. This was unfortunately decided before it was evident that a submodel would be required. Regarding this location, you are correct that I wish to determine the strength of the section against a yield criterion, as opposed to the fatigue damage. I can see why the stress would be defined as a secondary stress according to a pressure vessel design code. Most structural steelwork codes however don't seem to classify stresses in the same way though. AISC or DNV, for instance just give limits on the calculated stresses without classifying them as primary or secondary (or maybe I'm looking in the wrong sections?). Is it therefore still valid to draw a line through the results to remove the peak? A good way to show the stresses through the section is to plot those which are acceptable and those which are not. This is shown in the figure at the link below. It is then to be judged as to whether the concentration extends significantly enough to cause yielding of the entire section. • RE: Peak stress in solid FE models (Mechanical) 19 Mar 08 18:14. The problem with structural codes, as I see it, is that they're based upon hand calculations of simple direct and bending stresses and don't consider the extent to which finite element methods can predict stresses. In fact I don't think they consider thermal stresses from what I remember. The pressure vessel codes do give more thorough ways of assessing stresses which the structural codes I've seen don't seem to possess. Another aspect of peak stresses in transient thermal analyses to consider is the non-linear stress distribution through the thickness, which your 3D solid model will pick up. Your stress distribution might therefore be composed of this thermal stress component as well as the stress concentration from a geometric feature. You may need to calculate the equivalent linear bending stresses through the thickness of each section, and thus remove that peak component to leave only the secondary stress (range) and peak stress from the geometric feature. Effectively you'd have to extrapolate your results in two directions to remove any peak stress components. In your case it's clear that the stresses at the fillet are due to the stress concentration of the geometry (plus perhaps a thermal peak stress). Stresses at 1.0t from the weld toe should be considered as nominal stresses and assessed accordingly. Corus RE: Peak stress in solid FE models (Mechanical) 26 Mar 08 10:42. I would like to make one more comment on calculation of limit loads. This may be obvious to some. One knows the target factor of safety. In non-linear zone the factor of safety should be based on load and not stress. For example let us say that the factor of safety is 3. One could run another analysis with 3 times the load and look at the results. If the part has not yielded through the section, one may consider it safe. On the other hand if the run does not converge, it may indicate the part does not have the adequate factor of safety. Gurmeet RE: Peak stress in solid FE models (Mechanical) 31 Mar 08 03:34. Hi, yes, and in addition to what Gurmeet says, I'd add (just because I've seen it asked sometimes in Eng-tips threads.): when you perform a plastic analysis against direct collapse, you can not consider stresses in the plasticized zone: of course, they will be clipped to the yield value of the material (slightly more due to numerical reasons). You will have to: - either compare the strains to related limits - either perform a 'limit-load' verification as suggested. The important thing is that, in most cases, the direct collapse verification is subjected to strain limits by codes like EN-13445, not to limit-load safety factors (though these can be far more 'understandable').
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Furthermore, Flash Format lets you activate AutoRun on any storage card (without reformatting), so that your games, MP3 playlists, eBooks or PhotoAlbums can be automatically started at card insertion. Version 2.85 provides faster formatting and improved compatibility with the latest Windows Mobile devices. Full Specifications What's new in version 2.85 Version 2.85 provides faster formatting and improved compatibility with the latest Windows Mobile devices. General Publisher Publisher web site Release Date December 23, 2008 Date Added December 23, 2008 Version 2.85 Category Category Subcategory Operating Systems Operating Systems Pocket PC 2000, Pocket PC 2002, Windows Mobile 2003/2003 Phone Edition/2003 SE/5.x/6.x Additional Requirements Pocket PC/2002/Windows Mobile 2003/SE/5.x/6.x Download Information File Size 529.46KB File Name F4285WPE.EXE Popularity Total Downloads 97,193 Downloads Last Week 337 Pricing License Model Free to try Limitations 10-day trial Price $12.95. SD (top), miniSD, microSD cards Media type Capacity SDSC (SD): 1 MB to 2 GB, some 4 GB were made SDHC. Contents • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Overview [ ] Secure Digital includes four card families available in three different sizes. The four families are the original Standard-Capacity (SDSC), the High-Capacity (SDHC), the eXtended-Capacity (), and the, which combines functions with data storage. The are the original size, the mini size, and the micro size. Electrically passive adapters allow a smaller card to fit and function in a device built for a larger card. The SD card's small footprint is an ideal storage medium for smaller, thinner and more portable electronic devices. SD (SDSC) [ ]. This section does not any. Unsourced material may be challenged and. (October 2016) () The second-generation Secure Digital (SDSC or Secure Digital Standard Capacity) card was developed to improve on the (MMC) standard, which continued to evolve, but in a different direction. Secure Digital changed the MMC design in several ways: • Asymmetrical shape of the sides of the SD card prevent inserting it upside down (while an MMC goes in most of the way but makes no contact if inverted). • Most SD cards are 2.1 mm (0.083 inches) thick, compared to 1.4 mm (0.055 inches) for MMCs. The SD specification defines a card called Thin SD with a thickness of 1.4 mm, but they occur only rarely, as the SDA went on to define even smaller form factors. • The card's electrical contacts are recessed beneath the surface of the card, protecting them from contact with a user's fingers. • The SD specification envisioned capacities and transfer rates exceeding those of MMC, and both of these functionalities have grown over time. For a comparison table, see. • While MMC uses a single pin for data transfers, the SD card added a four-wire bus mode for higher data rates. • The SD card added (CPRM) security circuitry for (DRM) content-protection. • Addition of a write-protect notch Full-size SD cards do not fit into the slimmer MMC slots, and other issues also affect the ability to use one format in a host device designed for the other. Official SDHC logo The Secure Digital High Capacity (SDHC) format, announced in January 2006 and defined in version 2.0 of the SD specification, supports cards with capacities up to 32 GB. The SDHC trademark is licensed to ensure compatibility. SDHC cards are physically and electrically identical to standard-capacity SD cards (SDSC). The major compatibility issues between SDHC and SDSC cards are the redefinition of the Card-Specific Data (CSD) register in version 2.0 (see ), and the fact that SDHC cards are shipped preformatted with the file system. Version 2.0 also introduces a High-speed bus mode for both SDSC and SDHC cards, which doubles the original Standard Speed clock to produce 25. SDHC host devices are required to accept older SD cards. However, older host devices do not recognize SDHC or SDXC memory cards, although some devices can do so through a firmware upgrade. Older Windows operating systems released before Windows 7 require patches or service packs to support access to SDHC cards. Official SDXC logo The Secure Digital eXtended Capacity (SDXC) format, announced in January 2009 and defined in version 3.01 of the SD specification, supports cards up to 2 TB (2048 GB), compared to a limit of 32 GB for SDHC cards in the SD 2.0 specification. SDXC adopts Microsoft's file system as a mandatory feature. Version 3.01 also introduced the for both SDHC and SDXC cards, with interface speeds from 50 MByte/s to 104 MByte/s for four-bit UHS-I bus. Version 4.0, introduced in June 2011, allows speeds of 156 MByte/s to 312 MByte/s over the four-lane (two differential lanes) UHS-II bus, which requires an additional row of physical pins. Version 5.0 was announced in February 2016 at CP+ 2016, and added 'Video Speed Class' ratings for UHS cards to handle higher resolution video formats like. The new speed ratings go up to 90 MB/s. ExFAT filesystem [ ]. This section needs additional citations for. Unsourced material may be challenged and removed. (October 2016) () SDXC cards utilize the file system, the use of which is governed by a proprietary license, thereby limiting its legal availability to a small set of operating systems. Therefore, exFAT-formatted SDXC cards are not a universally readable exchange medium. (SP1) and later and (10.6.5 and later) support exFAT out of the box. (Windows XP and Server 2003 can support exFAT via an optional update from Microsoft.) Most and distributions do not, for legal reasons; users must manually install third-party implementations of exFAT (as a module) in order to be able to mount exFAT-formatted volumes. However, SDXC cards can be reformatted to use any file system (such as,, or ), alleviating the restrictions associated with exFAT availability. Nevertheless, in order to be fully compliant with the SDXC card specification, many SDXC-capable host devices are firmware-programmed to expect exFAT on cards larger than 32 GB [ ]. Consequently, they may not accept SDXC cards reformatted as FAT32, even if the device supports FAT32 on smaller cards (for SDHC compatibility). Therefore, even if a file system is supported in general, it is not always possible to use alternative file systems on SDXC cards at all depending on how strictly the SDXC card specification has been implemented in the host device. This bears a risk of accidental loss of data, as a host device may treat a card with an unrecognized file system as blank or damaged and. The SD Association provides a formatting utility for Windows and Mac OS X that checks and formats SD, SDHC, and SDXC cards. Ultra High Speed (UHS) bus [ ]. Back side of a Lexar UHS-II microSDHC card, showing the additional row of UHS-II connections The Ultra High Speed (UHS) bus is available on some SDHC and SDXC cards. The following ultra-high speeds are specified: UHS-I Specified in SD version 3.01, supports a clock frequency of 100 MHz (a quadrupling of the original 'Default Speed'), which in four-bit transfer mode could transfer 50 MB/s (SDR50). UHS-I cards declared as UHS104 (SDR104) also support a clock frequency of 208 MHz, which could transfer 104 MB/s. Operation at 50 MHz (DDR50) is also specified in Version 3.01, and is mandatory for microSDHC and microSDXC cards labeled as UHS-I. In this mode, four bits are transferred when the clock signal rises and another four bits when it falls, transferring an entire byte on each full clock cycle, hence a 50 MB/s operation could be transferred using a 50 MHz clock. UHS-II Specified in version 4.0, further raises the data transfer rate to a theoretical maximum of 156 MB/s (full ) or 312 MB/s (half duplex) using an additional row of pins (a total of 17 pins for full-size and 16 pins for micro-size cards). UHS-III Version 6.0, released in February 2017, added two new data rates to the standard. FD312 provides 312 MB/s while FD624 doubles that. Both are full-duplex. The physical interface and pin-layout are the same as with UHS-II, retaining backward compatibility. Cards that comply with UHS show Roman numerals 'I', 'II' or 'III' next to the SD card logo, and report this capability to the host device. Use of UHS-I requires that the host device command the card to drop from 3.3-volt to 1.8-volt operation over the I/O interface pins and select the four-bit transfer mode, while UHS-II requires 0.4-volt operation. The higher speed rates are achieved by using a two-lane low voltage (0.4 V pp) differential interface. Each lane is capable of transferring up to 156 MB/s. In full duplex mode, one lane is used for Transmit while the other is used for Receive. In half duplex mode both lanes are used for the same direction of data transfer allowing a double data rate at the same clock speed. In addition to enabling higher data rates, the UHS-II interface allows for lower interface power consumption, lower I/O voltage and lower electromagnetic interference (EMI). Speeds [ ] SD card speed is customarily rated by its sequential read or write speed. The sequential performance aspect is the most relevant for storing and retrieving large files (relative to block sizes internal to the ), such as images and multimedia. Small data (such as file names, sizes and timestamps) falls under the much lower, which can be the limiting factor in some use cases. With early SD cards, a few card manufacturers specified the speed as a 'times' ('×') rating, which compared the average speed of reading data to that of the original drive. This was superseded by the Speed Class Rating, which guarantees a minimum rate at which data can be written to the card. The newer families of SD card improve card speed by increasing the bus rate (the frequency of the clock signal that strobes information into and out of the card). Whatever the bus rate, the card can signal to the host that it is 'busy' until a read or a write operation is complete. Compliance with a higher speed rating is a guarantee that the card limits its use of the 'busy' indication. Bus interface Card logo Bus logo Bus speed Spec version Default Speed — 12.5 MByte/s 1.01 High Speed 25 MByte/s 2.00 UHS-I 12.5 MByte/s (SDR12) 25 MByte/s (SDR25) 50 MByte/s (SDR50, DDR50) 104 MByte/s (SDR104) 3.01 UHS-II 156 MByte/s (FD156) 312 MByte/s (HD312) 4.00/4.10 UHS-III 312 MByte/s (FD312) 624 MByte/s (FD624) 6.0 Speed class rating [ ]. Main article: The '×' rating, that was used by some card manufacturers and made obsolete by speed classes, is a multiple of the standard drive speed of 150 (approximately 1.23 ). Basic cards transfer data at up to six times (6×) the CD-ROM speed; that is, 900 KiB/s or 7.37 Mbit/s. The 2.0 specification [ ] defines speeds up to 200×, but is not as specific as Speed Classes are on how to measure speed. Manufacturers may report best-case speeds and may report the card's fastest read speed, which is typically faster than the write speed. Some vendors, including and, report their cards' write speed. When a card lists both a speed class and an '×' rating, the latter may be assumed a read speed only. Real-world performance [ ] In applications that require sustained write throughput, such as video recording, the device might not perform satisfactorily if the SD card's class rating falls below a particular speed. For example, a high-definition may require a card of not less than Class 6, suffering dropouts or corrupted video if a slower card is used. With slow cards may take a noticeable time after taking a photograph before being ready for the next, while the camera writes the first picture. The speed class rating does not totally characterize card performance. Different cards of the same class may vary considerably while meeting class specifications. A card's speed depends on many factors, including: • The frequency of soft errors that the card's controller must re-try •: The flash controller may need to overwrite more data than requested. This has to do with performing read-modify-write operations on write blocks, freeing up (the much larger) erase blocks, while moving data around to achieve. •: where there is not sufficient space for a file to be recorded in a contiguous region, it is split into non-contiguous fragments. This does not cause rotational or head-movement delays as with electromechanical, but may decrease speed; for instance, by requiring additional reads and computation to determine where on the card the file's next fragment is stored. In addition, speed may vary markedly between writing a large amount of data to a single file (, as when a records large photographs or videos) and writing a large number of small files (a use common in ). A study in 2012 found that, in this random-access use, some Class 2 cards achieved a write speed of 1.38, while all cards tested of Class 6 or greater (and some of lower Classes; lower Class does not necessarily mean better small-file performance), including those from major manufacturers, were over 100 times slower. In 2014, a blogger measured a 300-fold performance difference on small writes; this time, the best card in this category was a class 4 card. Features [ ] Card security [ ] Cards can protect their contents from erasure or modification, prevent access by non-authorized users, and protect copyrighted content using digital rights management. [ ] Commands to disable writes [ ]. Unlocked and locked SD cards The user can designate most full-size SD cards as read-only by use of a sliding tab that covers a notch in the card. The miniSD and microSD formats do not support a write protection notch. When looking at the SD card from the top, the right side (the side with the beveled corner) must be notched. On the left side, there may be a write-protection notch. If the notch is omitted, the card can be read and written. If the card is notched, it is read-only. If the card has a notch and a sliding tab which covers the notch, the user can slide the tab upward (toward the contacts) to declare the card read/write, or downward to declare it read-only. The diagram to the right shows an orange sliding write-protect tab in both the unlocked and locked positions. The presence of a notch, and the presence and position of a tab, have no effect on the SD card's operation. A host device that supports write protection should refuse to write to an SD card that is designated read-only in this way. Some host devices do not support write protection, which is an optional feature of the SD specification. Drivers and devices that do obey a read-only indication may give the user a way to override it. Cards sold with content that must not be altered are permanently marked read-only by having a notch and no sliding tab. Card password [ ]. MicroSD to SD adapter (left), microSD to miniSD adapter (middle), microSD card (right) A host device can lock an SD card using a password of up to 16 bytes, typically supplied by the user. A locked card interacts normally with the host device except that it rejects commands to read and write data. A locked card can be unlocked only by providing the same password. The host device can, after supplying the old password, specify a new password or disable locking. Without the password (typically, in the case that the user forgets the password), the host device can command the card to erase all the data on the card for future re-use (except card data under DRM), but there is no way to gain access to the existing data. Devices use SD cards designed for access only by the phone manufacturer or mobile provider. An SD card inserted into the phone underneath the battery compartment becomes locked 'to the phone with an automatically generated key' so that 'the SD card cannot be read by another phone, device, or PC'. Devices, however, are some of the few that can perform the necessary low-level format operations on locked SD cards. It is therefore possible to use a device such as the to reformat the card for subsequent use in other devices. SmartSD cards [ ] A smartSD memory card is a microSD card with an internal 'secure element' that allows the transfer of ISO 7816 commands to, for example, applets running on the internal secure element through the SD bus. Various implementations of smartSD cards have been done for payment applications and secured authentication. MicroSD cards with Secure Element and NFC () support are used for payment and secure access. Vendor enhancements [ ]. SD cards with dual interfaces: SD and Vendors have sought to differentiate their products in the market through various vendor-specific features: • Integrated – Several companies produce SD cards with built-in Wi-Fi transceivers supporting static security (WEP 40; 104; and 128, WPA-PSK, and WPA2-PSK). The card lets any digital camera with an SD slot transmit captured images over a wireless network, or store the images on the card's memory until it is in range of a wireless network. Examples include: /,,,, and. Some models their pictures. • Pre-loaded content – In 2006, SanDisk announced, a microSD card with extra digital rights management features, which they intended as a medium for publishing content. SanDisk again announced pre-loaded cards in 2008, under the name, this time not using any of the DRM capabilities of the SD card. In 2011, SanDisk offered various collections of 1000 songs on a single slotMusic card for about $40, now restricted to compatible devices and without the ability to copy the files. • Integrated USB connector – The SD Plus product can be plugged directly into a port without needing a USB card reader. Other companies introduced comparable products, such as the Duo SD product of OCZ Technology and the 3 Way (microSDHC, SDHC, and USB) product of A-DATA, which was available in 2008 only. • Different colors – SanDisk has used various colors of plastic or adhesive label, including a 'gaming' line in translucent plastic colors that indicated the card's capacity. • Integrated display – In 2006, A-DATA announced a Super Info SD card with a digital display that provided a two-character label and showed the amount of unused memory on the card. SDIO cards [ ]. Camera using the SDIO interface to connect to some HP iPAQ devices A SDIO (Secure Digital Input Output) card is an extension of the SD specification to cover I/O functions. SDIO cards are only fully functional in host devices designed to support their input-output functions (typically PDAs like the, but occasionally laptops or mobile phones). These devices can use the SD slot to support receivers,,, tuners, TV tuners, readers,, and interfaces to,,, and. Many other SDIO devices have been proposed, but it is now more common for I/O devices to connect using the USB interface. SDIO cards support most of the memory commands of SD cards. SDIO cards can be structured as eight logical cards, although currently, the typical way that an SDIO card uses this capability is to structure itself as one I/O card and one memory card. The SDIO and SD interfaces are mechanically and electrically identical. Host devices built for SDIO cards generally accept SD memory cards without I/O functions. However, the reverse is not true, because host devices need suitable drivers and applications to support the card's I/O functions. For example, an HP SDIO camera usually does not work with PDAs that do not list it as an accessory. Inserting an SDIO card into any SD slot causes no physical damage nor disruption to the host device, but users may be frustrated that the SDIO card does not function fully when inserted into a seemingly compatible slot. (USB and Bluetooth devices exhibit comparable compatibility issues, although to a lesser extent thanks to standardized and.) The family comprises Low-Speed and Full-Speed cards. Both types of SDIO cards support SPI and one-bit SD bus types. Low-Speed SDIO cards are allowed to also support the four-bit SD bus; Full-Speed SDIO cards are required to support the four-bit SD bus. To use an SDIO card as a 'combo card' (for both memory and I/O), the host device must first select four-bit SD bus operation. Two other unique features of Low-Speed SDIO are a maximum clock rate of 400 kHz for all communications, and the use of Pin 8 as 'interrupt' to try to initiate dialogue with the host device. Ganging cards together The one-bit SD protocol was derived from the MMC protocol, which envisioned the ability to put up to three cards on a bus of common signal lines. The cards use interfaces, where a card may pull a line to the low voltage level; the line is at the high voltage level (because of a ) if no card pulls it low. Though the cards shared clock and signal lines, each card had its own line to sense that the host device had selected it. [ ] The SD protocol envisioned the ability to gang 30 cards together without separate chip select lines. The host device would broadcast commands to all cards and identify the card to respond to the command using its unique serial number. [ ] In practice, cards are rarely ganged together because open-collector operation has problems at high speeds and increases power consumption. Newer versions of the SD specification recommend separate lines to each card. [ ] Compatibility [ ] Host devices that comply with newer versions of the specification provide and accept older SD cards. For example, SDXC host devices accept all previous families of SD memory cards, and SDHC host devices also accept standard SD cards. Older host devices generally do not support newer card formats, and even when they might support the bus interface used by the card, there are several factors that arise: • A newer card may offer than the host device can handle (over 4 GB for SDHC, over 32 GB for SDXC). • A newer card may use a the host device cannot navigate ( for SDHC, for SDXC) • Use of an SDIO card requires the host device be designed for the input/output functions the card provides. • The hardware interface of the card was changed starting with the version 2.0 (new high-speed bus clocks, redefinition of ) and family (Ultra-high speed (UHS) bus) • UHS-II has physically more pins but is backwards compatible to UHS-I and non-UHS for both slot and card. • Some vendors produced SDSC cards above 1GB before the SDA had standardized a method of doing so. SD compatibility table SDSC card SDHC card SDHC UHS card SDXC card SDXC UHS card SDIO card SDSC slot Yes No No No No No SDHC slot Yes Yes Yes No No No SDHC UHS slot Yes Yes Yes No No No SDXC slot Yes Yes Yes Yes Yes No SDXC UHS slot Yes Yes Yes Yes Yes No SDIO slot Varies Varies Varies Varies Varies Yes. This microSDHC card holds 8 billion bytes. Beneath it is a section of a (used until the 1970s) that holds eight bytes using 64 cores. The SD card has a capacity one billion times larger. In 1999,,, and agreed to develop and market the Secure Digital (SD) Memory Card. The card was derived from the (MMC) and provided digital rights management based on the (SDMI) standard and for the time, a high memory density. It was designed to compete with the, a DRM product that had released the year before. Developers predicted that DRM would induce wide use by music suppliers concerned about piracy. The SD was originally developed for the, which was the unsuccessful Toshiba entry in the. For this reason the D within the logo resembles an optical disc. At the 2000 (CES) trade show, the three companies announced the creation of the SD Association (SDA) to promote SD cards. The SD Association, headquartered in San Ramon, California, United States, started with about 30 companies and today consists of about 1,000 product manufacturers that make interoperable memory cards and devices. Early samples of the SD Card became available in the first quarter of 2000, with production quantities of 32 and 64 cards available three months later. Mini- and micro-cards [ ] The miniSD form was introduced at March 2003 by Corporation which announced and demonstrated it. The SDA adopted the miniSD card in 2003 as a small form factor extension to the SD card standard. While the new cards were designed especially for mobile phones, they are usually packaged with a miniSD adapter that provides compatibility with a standard SD memory card slot. In September 2006, SanDisk announced the 4 GB miniSDHC. Like the SD and SDHC, the miniSDHC card has the same form factor as the older miniSD card but the HC card requires HC support built into the host device. Devices that support miniSDHC work with miniSD and miniSDHC, but devices without specific support for miniSDHC work only with the older miniSD card. Since 2008, miniSD cards were no longer produced. The microSD removable miniaturized Secure Digital flash memory cards were originally named T-Flash or TF, abbreviations of TransFlash. TransFlash and microSD cards are functionally identical allowing either to operate in devices made for the other. SanDisk had conceived microSD when its and the chief technology officer of concluded that current memory cards were too large for. The card was originally called T-Flash, but just before product launch, T-Mobile sent a order to SanDisk claiming that T-Mobile owned the trademark on T-(anything), [ ] and the name was changed to TransFlash. At CTIA Wireless 2005, the SDA announced the small microSD form factor along with SDHC secure digital high capacity formatting in excess of 2 GB with a minimum sustained read and write speed of 17.6 Mbit/s. SanDisk induced the SDA to administer the microSD standard. The SDA approved the final microSD specification on July 13, 2005. Initially, microSD cards were available in capacities of 32, 64, and 128 MB. The Motorola E398 was the first mobile phone to contain a TransFlash (later microSD) card. A few years later, their competitors began using microSD cards. SDIO, SDHC, and SDXC [ ] In April 2006, the SDA released a detailed specification for the non-security related parts of the SD memory card standard and for the Secure Digital Input Output (SDIO) cards and the standard SD host controller. [ ] The SDHC format, announced in January 2006, brought improvements such as 32 GB storage capacity and mandatory support for filesystems. [ ] In January 2009, the SDA announced the SDXC family, which supports cards up to 2 TB and speeds up to 300 MB/s. [ ] It features mandatory support for the filesystem. [ ] SDXC was announced at (CES) 2009 (January 7–10, 2009). At the same show, and also announced a comparable variant with the same 2 TB maximum as SDXC, and announced plans to produce 64 GB SDXC cards. On March 6, 2009, Pretec introduced the first SDXC card, a 32 GB card with a read/write speed of 400 Mbit/s. But only early in 2010 did compatible host devices come onto the market, including 's HDR-CX55V, 's (also known as Rebel T2i) Digital SLR camera, a USB card reader from Panasonic, and an integrated SDXC card reader from JMicron. The earliest laptops to integrate SDXC card readers relied on a USB 2.0 bus, which does not have the bandwidth to support SDXC at full speed. Also in early 2010, commercial SDXC cards appeared from (64 GB), Panasonic (64 GB and 48 GB), and SanDisk (64 GB). In early 2011, (64 GB and 128 GB) and (128 GB) began shipping SDXC cards rated at Speed Class 10. Pretec offered cards from 8 GB to 128 GB rated at Speed Class 16. In September 2011, SanDisk released a 64 GB microSDXC card. Kingmax released a comparable product in 2011. In late 2012, Lexar released the first 256 GB SDXC card, based on 20 nm technology. In April 2012, Panasonic introduced card format for professional video applications. The cards are essentially full-size SDHC or SDXC cards, rated at UHS Speed Class U1. An adapter allows MicroP2 cards to work in current equipment. Panasonic MicroP2 cards shipped in March 2013 and were the first UHS-II compliant products on market; initial offer includes a 32GB SDHC card and a 64GB SDXC card. In February 2014, SanDisk introduced the first 128 GB microSDXC card, which was followed by a 200 GB microSDXC card in March 2015. September 2014 saw SanDisk announce the first 512 GB SDXC card. Samsung announced the world's first EVO Plus 256 GB microSDXC card in May 2016. And in September 2016 announced that a prototype of the first 1 TB SDXC card will be demonstrated. In August 2017, SanDisk launched a 400 GB microSDXC card. Markets [ ] Secure Digital cards are used in many consumer electronic devices, and have become a widespread means of storing several gigabytes of data in a small size. [ ] Devices in which the user may remove and replace cards often, such as,, and, tend to use full-sized cards. [ ] Devices in which small size is paramount, such as, tend to use microSD cards. [ ] The microSD card has helped propel the smartphone market by giving both manufacturers and consumers greater flexibility and freedom. [ ] Due to their compact size, microSD cards are used in many [ ] different applications in a large variety [ ] of markets. Action cameras, such as the GoPRO's Hero and cameras in drones, frequently use microSD cards. [ ] Latest versions of major operating systems, including Windows Mobile and Android Marshmallow, allow applications to run from microSD cards creating possibilities for new usage models for SD cards in mobile computing markets. SD cards are not the most economical solution in devices that need only a small amount of non-volatile memory, such as station presets in small radios. They may also not present the best choice for applications that require higher storage capacities or speeds as provided by other flash card standards such as. These limitations may be addressed by evolving memory technologies, such as the world's highest capacity SanDisk Ultra 200GB Micro SD released in 2015. Pro 64 GB microSDXC original (left) and counterfeit (right): The counterfeit claims to have 64 GB in capacity, but only 8 GB (Class 4 speed) are usable: When trying to write more than 8 GB, occurs. Also used for 64 GB fakes. Many personal computers of all types, including tablets and mobile phones, use SD cards, either through built-in slots or through an active electronic adaptor. Adaptors exist for the, ExpressBus,,, and the. Active adaptors also let SD cards be used in devices designed for other formats, such as. The adaptor lets SD cards be used in a drive. Counterfeits [ ]. This section needs additional citations for. Unsourced material may be challenged and removed. (October 2016) () SD/MMC cards replaced 's as the dominant memory card format used in digital cameras. In 2001, SmartMedia had achieved nearly 50% use, but, by 2005, SD/MMC had achieved over 40% of the digital camera market and SmartMedia's share had plummeted by 2007. At this time, all the leading digital camera manufacturers used SD in their consumer product lines, including,,,,,,,,,,, and. Formerly, and used (xD cards) exclusively, while only used; by early 2010 all three supported SD. Some and professional digital cameras continued to offer (CF), either on a second card slot or as the only storage, as CF supports much higher maximum capacities and historically was cheaper for the same capacity. Secure Digital memory cards can be used in Sony EX with an adapter and in Panasonic equipment with a adapter. Personal computers [ ] Although many accommodate SD cards as an auxiliary storage device through a built-in slot or a USB adaptor, SD cards cannot be used as the primary through the onboard controller because none of the SD card variants support ATA signalling. This use requires a separate SD controller chip or an SD-to-CompactFlash converter. However, on computers that support from a USB interface, an SD card in a USB adaptor can be the primary hard disk, provided it contains an operating system that supports USB access once the bootstrap is complete. Since late 2009, newer computers with installed SD card readers have been able to boot in from SD storage devices, when properly formatted to file format and the default partition table set to. Embedded systems [ ]. A shield () that gives prototyping microprocessors access to SD cards In 2008, the SDA specified Embedded SD, 'leverag[ing] well-known SD standards' to enable non-removable SD-style devices on printed circuit boards. However this standard was not adopted by the market while the MMC standard became the de facto standard for embedded systems. SanDisk provides such embedded memory components under the iNAND brand. Most modern have built-in logic that can interface to an SD card operating in its SPI mode, providing non-volatile storage. Even if a microcontroller lacks the SPI feature, the feature can be emulated. For example, a home-brew combines spare (GPIO) pins of the processor of the router with MMC support code from the. This technique can achieve throughput of up to 1.6. Technical details [ ] Physical size [ ] The SD card specification defines three physical sizes. The SD and SDHC families are available in all three sizes, but the SDXC family is not available in the mini size, and the SDIO family is not available in the micro size. Smaller cards are usable in larger slots through use of a passive adapter. Standard size [ ]. Size comparison of families: SD (blue), miniSD (green), microSD (red) • SD (SDSC), SDHC, SDXC, SDIO • 32.0×24.0×2.1 mm (1.260×0.945×0.083 in) • 32.0×24.0×1.4 mm (1.260×0.945×0.055 in) (as thin as MMC) for Thin SD (rare) Mini size [ ] • miniSD, miniSDHC, miniSDIO • 21.5×20.0×1.4 mm (0.846×0.787×0.055 in) Micro size [ ] The micro form factor is the smallest SD card format. • microSD, microSDHC, microSDXC • 15.0×11.0×1.0 mm (0.591×0.433×0.039 in) Transfer modes [ ] Cards may support various combinations of the following bus types and transfer modes. The SPI bus mode and one-bit SD bus mode are mandatory for all SD families, as explained in the next section. Once the host device and the SD card negotiate a bus interface mode, the usage of the numbered pins is the same for all card sizes. • SPI bus mode: is primarily used by embedded. This bus type supports only a 3.3-volt interface. This is the only bus type that does not require a host license. • One-bit SD bus mode: Separate command and data channels and a proprietary transfer format. • Four-bit SD bus mode: Uses extra pins plus some reassigned pins. This is the same protocol as the one-bit SD bus mode which uses one command and four data lines for faster data transfer. All SD cards support this mode. UHS-I and UHS-II require this bus type. • Two differential lines SD UHS-II mode: Uses two low-voltage differential interfaces to transfer commands and data. UHS-II cards include this interface in addition to the SD bus modes. The physical interface comprises 9 pins, except that the miniSD card adds two unconnected pins in the center and the microSD card omits one of the two V SS (Ground) pins. Official pin numbers for each card type (top to bottom):, SD, miniSD, microSD. This shows the evolution from the older MMC, on which SD is based. NOTE: This drawing doesn't show 8 new UHS-II contacts that were added in spec 4.0. SPI bus mode pin SD pin miniSD pin microSD pin Name I/O Logic Description 1 1 1 2 nCS I PP SPI Card Select [CS] (Negative logic) 2 2 2 3 DI I PP SPI Serial Data In [MOSI] 3 3 3 VSS S S Ground 4 4 4 4 VDD S S Power 5 5 5 5 CLK I PP SPI Serial Clock [SCLK] 6 6 6 6 VSS S S Ground 7 7 7 7 DO O PP SPI Serial Data Out [MISO] 8 8 8 NC nIRQ. OD Unused (memory cards) Interrupt (SDIO cards) (negative logic) 9 9 1 NC.. Unused 10 NC.. Reserved 11 NC.. Reserved One-bit SD bus mode pin SD pin miniSD pin microSD pin Name I/O Logic Description 1 1 1 2 CD I/O. Card detection (by host), and non-SPI mode detection (by card) 2 2 2 3 CMD I/O PP, OD Command, Response 3 3 3 VSS S S Ground 4 4 4 4 VDD S S Power 5 5 5 5 CLK I PP Serial clock 6 6 6 6 VSS S S Ground 7 7 7 7 DAT0 I/O PP SD Serial Data 0 8 8 8 NC nIRQ. OD Unused (memory cards) Interrupt (SDIO cards) (negative Logic) 9 9 1 NC.. Unused 10 NC.. Reserved 11 NC.. Reserved Four-bit SD bus mode pin SD pin miniSD pin microSD pin Name I/O Logic Description. 1 1 2 DAT3 I/O PP SD Serial Data 3. 2 2 3 CMD I/O PP, OD Command, Response. 3 3 VSS S S Ground. 4 4 4 VDD S S Power. 5 5 5 CLK I PP Serial clock. 6 6 6 VSS S S Ground. 7 7 7 DAT0 I/O PP SD Serial Data 0 8 8 8 DAT1 nIRQ I/O O PP OD SD Serial Data 1 (memory cards) Interrupt Period (SDIO cards share pin via protocol) 9 9 1 DAT2 I/O PP SD Serial Data 2 10 NC.. Reserved 11 NC.. Reserved Notes: • Direction is relative to card. I = Input, O = Output. • PP = logic, OD = logic. • S =, NC = Not Connected (or ). Interface [ ]. Inside a 16 GB SDHC card Command interface [ ] SD cards and host devices initially communicate through a one-bit interface, where the host device provides a clock signal that strobes single bits in and out of the SD card. The host device thereby sends 48-bit commands and receives responses. The card can signal that a response will be delayed, but the host device can abort the dialogue. Through issuing various commands, the host device can: • Determine the type, memory capacity, and capabilities of the SD card • Command the card to use a different voltage, different clock speed, or advanced electrical interface • Prepare the card to receive a block to write to the flash memory, or read and reply with the contents of a specified block. The command interface is an extension of the (MMC) interface. SD cards dropped support for some of the commands in the MMC protocol, but added commands related to copy protection. By using only commands supported by both standards until determining the type of card inserted, a host device can accommodate both SD and MMC cards. Electrical interface [ ] All SD card families initially use a 3.3 electrical interface. On command, SDHC and SDXC cards can switch to 1.8 V operation. At initial power-up or card insertion, the host device selects either the Serial Peripheral Interface (SPI) bus or the one-bit SD bus by the voltage level present on Pin 1. Thereafter, the host device may issue a command to switch to the four-bit SD bus interface, if the SD card supports it. For various card types, support for the four-bit SD bus is either optional or mandatory. After determining that the SD card supports it, the host device can also command the SD card to switch to a. Until determining the card's capabilities, the host device should not use a clock speed faster than 400 kHz. SD cards other than SDIO (see below) have a 'Default Speed' clock rate of 25 MHz. The host device is not required to use the maximum clock speed that the card supports. It may operate at less than the maximum clock speed to conserve power. Between commands, the host device can stop the clock entirely. Achieving higher card speeds [ ] The SD specification defines four-bit-wide transfers. (The MMC specification supports this and also defines an eight-bit-wide mode; MMC cards with extended bits were not accepted by the market.) Transferring several bits on each clock pulse improves the card speed. Advanced SD families have also improved speed by offering faster clock frequencies and double data rate (explained ) in a high-speed differential interface (UHS-II). [ ] File system [ ] Like other types of card, an SD card of any SD family is a, in which the host device can read or write fixed-size blocks by specifying their block number. [ ] MBR and FAT [ ] Most SD cards ship preformatted with one or more, where the first or only partition contains a. This lets them operate like the of a. This section needs additional citations for. Unsourced material may be challenged and removed. (November 2016) () Because the host views the SD card as a block storage device, the card does not require MBR partitions or any specific file system. The card can be reformatted to use any file system the operating system supports. For example: • Under, SD cards can be formatted using and, on later versions,. • Under, SD cards can be partitioned as devices and formatted with either or file systems or still use. • Under operating systems such as or, SD cards can be formatted using the,,,,,, or file system. Additionally under Linux, file systems may be accessed for read/write if the 'hfsplus' package is installed, and partitioned and formatted if 'hfsprogs' is installed. (These package names are correct under Debian, Ubuntu etc., but may differ on other Linux distributions.) Any recent version of the above can format SD cards using the file system. Additionally, as with flash drives, an SD card can have an operating system installed on it. Computers that can from an SD card (either using a USB adapter or inserted into the computer's flash media reader) instead of the hard disk drive may thereby be able to recover from a corrupted hard disk drive. Such an SD card can be to preserve the system's integrity. The SD Standard allows usage of only the above-mentioned Microsoft FAT file systems and any card produced in the market shall be preloaded with the related standard file system upon its delivery to the market. If any application or user re-formats the card with a non-standard file system the proper operation of the card, including interoperability, cannot be assured. Risks of reformatting [ ] Reformatting an SD card with a different file system, or even with the same one, may make the card slower, or shorten its lifespan. Some cards use, in which frequently modified blocks are mapped to different portions of memory at different times, and some wear-leveling algorithms are designed for the access patterns typical of FAT12, FAT16 or FAT32. In addition, the preformatted file system may use a cluster size that matches the erase region of the physical memory on the card; reformatting may change the cluster size and make writes less efficient. SD/SDHC/SDXC memory cards have a 'Protected Area' on the card for the SD standard's security function; a standard formatter may erase it, causing problems if security is used. The SD Association provides freely-downloadable SD Formatter software to overcome these problems for Windows and Mac OS X. The SD Formatter does not format the 'Protected Area', and the Association recommends the use of appropriate application software or SD-compatible device that provides SD security function to format the 'Protected Area' in the memory card. Power consumption [ ] The power consumption of SD cards varies by its speed mode, manufacturer and model. During transfer it may be in the range of 66–330 mW (20–100 mA at a supply voltage of 3.3 V). Specifications from TwinMos technologies list a maximum of 149 mW (45 mA) during transfer. Toshiba lists 264–330 mW (80–100 mA). Standby current is much lower, less than 0.2 mA for one 2006 microSD card. If there is data transfer for significant periods, battery life may be reduced noticeably (smartphones typically have batteries of capacity around 6 Wh (Samsung Galaxy S2, 1650 mAh @ 3.7 V)). Modern UHS-II cards can consume up to 2.88 W, if the host device supports bus speed mode SDR104 or UHS-II. Minimum power consumption in the case of a UHS-II host is 0.72 W. Card requirements regarding bus speed modes Bus speed mode *1 Max. Bus speed [MB/s] Max. 4 GB SDSC card A host device can ask any inserted SD card for its 128-bit identification string (the Card-Specific Data or CSD). In standard-capacity cards (SDSC), 12 bits identify the number of memory clusters (ranging from 1 to 4,096) and 3 bits identify the number of blocks per cluster (which decode to 4, 8, 16, 32, 64, 128, 256, or 512 blocks per cluster). The host device multiplies these figures (as shown in the following section) with the number of bytes per block to determine the card's capacity in bytes. [ ] SD version 1.00 assumed 512 bytes per block. This permitted SDSC cards up to 4,096 × 512 × 512 = 1 GB, for which there are no known incompatibilities. [ ] Version 1.01 let an SDSC card use a 4-bit field to indicate 1,024 or 2,048 bytes per block instead. Doing so enabled cards with 2 GB and 4 GB capacity, such as the Transcend 4 GB SD card and the Memorette 4GB SD card. Early SDSC host devices that assume 512-byte blocks therefore do not fully support the insertion of 2 GB or 4 GB cards. In some cases, the host device can read data that happens to reside in the first 1 GB of the card. If the assumption is made in the driver software, success may be version-dependent. In addition, any host device might not support a 4 GB SDSC card, since the specification lets it assume that 2 GB is the maximum for these cards. [ ] Storage capacity calculations [ ] The format of the Card-Specific Data (CSD) register changed between version 1 (SDSC) and version 2.0 (which defines SDHC and SDXC). Dismantled microSD to SD adapter showing the passive connection from the microSD card slot on the bottom to the SD pins on the top Like most memory card formats, SD is covered by numerous and. Royalties for SD card licences are imposed for manufacture and sale of memory cards and host adapters (US$1,000/year plus membership at US$1,500/year), but cards can be made without royalties. Early versions of the SD specification were available only after agreeing to a (NDA) that prohibited development of an driver. However, the system was eventually, and free software drivers provided access to SD cards that did not use DRM. Since then, the SDA has provided a simplified version of the specification under a less restrictive license. Although most open-source drivers were written before this, it has helped to solve compatibility issues. In 2006, the SDA released a simplified version of the specification of the host controller interface (as opposed to the specification of SD cards) and later also for the physical layer, ASSD extensions, SDIO, and SDIO Type-A, under a disclaimers agreement. Again, most of the information had already been discovered and had a fully free driver for it. Still, building a chip conforming to this specification caused the project to claim 'the first truly Open Source SD implementation, with no need to obtain an SDI license or sign NDAs to create SD drivers or applications.' The proprietary nature of the complete SD specification affects, laptop computers, and some desktop computers; many desktop computers do not have card slots, instead using -based if necessary. These card readers present a standard interface to memory cards, thus separating the operating system from the details of the underlying SD interface. However, embedded systems (such as portable music players) usually gain direct access to SD cards and thus need complete programming information. Desktop card readers are themselves embedded systems; their manufacturers have usually paid the SDA for complete access to the SD specifications. Many notebook computers now include SD card readers not based on USB; device drivers for these essentially gain direct access to the SD card, as do embedded systems. The -bus interface mode is the only type that does not require a host license for accessing SD cards. Comparison to other flash memory formats [ ]. Size comparison of various flash cards: SD,,, Overall, SD is less open than. Those can be implemented without paying for licensing, royalties, or documentation. (CompactFlash and USB flash drives may require licensing fees for the use of the SDA's trademarked logos.) However, SD is much more open than, for which no public documentation nor any documented legacy implementation is available. All SD cards can be accessed freely using the well-documented bus. Cards are simply 18-pin chips in a special package and support for raw NAND flash access. Although the raw hardware interface to xD cards is well understood, the layout of its memory contents—necessary for interoperability with xD card readers and digital cameras—is totally undocumented. The consortium that licenses xD cards has not released any technical information to the public. Coos Art Museum Strategic Plan Mission Mission Coos Art Museum is the cornerstone of visual arts on Oregon's Southern Coast. Download User Manual: Canon P100-DHII Portable/Palm Printing Calculator - Service Manuals, User Guide, Reviews, Instruction Manuals and Owners Manuals. Porelon 78BR. Explore; Products; Support; About; Contact Canon; SHOP. Explore; Products; Support; About; Knowledge Base. Home Support; Calculators; Support Calculators; Portable_Palm Printers; P100-DHII. EXPLORE HOME; CANON SEE IMPOSSIBLE; NATIONAL GEOGRAPHIC: EARTH LIVE. Results 1 - 16 of 16. Find Your Cannon P100 Dhii Manual User manuals,Cannon P100 Dhii Manual User guide,Cannon P100 Dhii Manual Operating Instructions,Cannon P100. Arts Education Curriculum Guide and Lessons Arts Lesson Plan Search - PBS Curricula Storyboard Blank Template Focus on Photography: A. Pens Black Box 50 BIC Cristal Xtra Life Ballpoint Pens Black Box 50 weekly 1.0. Weekly 1.0 Spirax P100 A4 Exercise Book PP Cover 8mm 48pg Spirax P100. Edge • A white bar will appear at the bottom of your browser window which will contain your download. Once the download is complete click 'Run' to begin the installation or click ‘View downloads’ to view the list of all recently downloaded files. • If the white bar is not visible you can also access the list of recently downloaded files by clicking the 3 small horizontal lines located in the top right of the browser • Click the down arrow icon to access the Downloads menu, from this list you can install the download by clicking on the file name • Alternatively, click 'Open folder' to open the folder on your computer that contains your downloaded files • You can then begin the installation of your download by double clicking your downloaded file. Chrome • A grey bar will appear at the bottom of your browser window which will contain your download. To install your download click on the name of the downloaded file. DISCLAIMER CANON U.S.A.,Inc. MAKES NO GUARANTEES OF ANY KIND WITH REGARD TO ANY PROGRAMS, FILES, DRIVERS OR ANY OTHER MATERIALS CONTAINED ON OR DOWNLOADED FROM THIS, OR ANY OTHER, CANON SOFTWARE SITE. ALL SUCH PROGRAMS, FILES, DRIVERS AND OTHER MATERIALS ARE SUPPLIED 'AS IS.' CANON DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT. CANON U.S.A.,Inc. SHALL NOT BE HELD LIABLE FOR ERRORS CONTAINED HEREIN, OR FOR LOST PROFITS, LOST OPPORTUNITIES, CONSEQUENTIAL OR INCIDENTAL DAMAGES INCURRED AS A RESULT OF ACTING ON INFORMATION, OR THE OPERATION OF ANY SOFTWARE, INCLUDED IN THIS SOFTWARE SITE. I have read and understand the information above, and wish to download the designated software. Calculator Warranty The limited warranty set forth by Canon U.S.A., Inc., (Canon U.S.A.) and Canon Canada Inc., (Canon Canada) with respect to Calculators purchased in the United States and Canada respectively. This limited warranty is only effective upon presentation of proof of purchase (bill of sale) to a Canon U.S.A. Or Canon Canada Factory Service Center. Canon Calculators, when delivered to you in a new condition in the original container, are warranted against defective materials or workmanship as follows: for a period of one (1) year from the date of purchase, defective parts or Calculators returned to a Canon U.S.A. Or Canon Canada Factory Service Center and proved to be defective upon inspection, will be exchanged at Canon U.S.A. Or Canon Canada sole option, for new comparable rebuilt parts or calculators (of the same or similar model). Warranty for replacement shall not extend the original warranty period of the defective calculator. When returning Calculators under this warranty, you must pre-pay the shipping charges, if any, and enclose a complete explanation of the problem. Calculators covered by this limited warranty will be repaired at Canon U.S.A. Or Canon Canada sole option, and returned to you without charge by any Canon U.S.A. Or Canon Canada Factory Service Center. This warranty does not cover rechargeable batteries that may be supplied with the Calculator, as to which batteries there shall be no warranty or replacement. A listing of Canon U.S.A. CONSUMER PRODUCTS INFORMATION CENTER AND CANON INFORMATION/SERVICE CENTER in Canada is included with the Calculator. The Canon U.S.A. CONSUMER PRODUCTS INFORMATION CENTER and CANON CANADA INFORMATION/SERVICE CENTER will refer you to the nearest Factory Service Center. Repairs not under warranty will be at such cost as Canon U.S.A. Or Canon Canada may from time to time generally establish. This limited warranty covers all defects encountered in normal use of the calculators, and does not apply to the following cases: • Loss or damage to the Calculators due to abuse, mishandling, alteration, accident, electrical current fluctuations, failure to follow operating instructions, maintenance and environmental instructions prescribed in Canon U.S.A.' S or Canon Canada's manual or service performed by other than a Canon U.S.A. Or Canon Canada Factory Service Center. • Use of parts (other than those distributed by Canon U.S.A. Or Canon Canada) which damage the Calculator or cause abnormally frequent service calls or service problems. • If any Calculator has had its serial number or dating altered or removed. • Loss or damage to the Calculator due to leaking batteries (other than rechargeable batteries supplies as original equipment with the Calculator by Canon U.S.A. Or Canon Canada) or water damage. NO IMPLIED WARRANTY (OR CONDITION)* INCLUDING ANY IMPLIED WARRANTY (OR CONDITION)* OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, APPLIES TO THE CALCULATORS AFTER THE APPLICABLE PERIOD OF EXPRESS WARRANTY STATED ABOVE. AND NO OTHER EXPRESS WARRANTY OR GUARANTY, EXCEPT AS MENTIONED ABOVE, GIVEN BY ANY OTHER PERSON, FIRM OR CORPORATION WITH RESPECT TO THE CALCULATORS SHALL BIND CANON U.S.A. OR CANON CANADA. (SOME STATES OR PROVINCES DO NOT ALLOW LIMITATIONS ON HOW LONG AN IMPLIED WARRANTY LASTS, SO THE ABOVE LIMITATION MAY NOT APPLY TO YOU) NEITHER CANON U.S.A. OR CANON CANADA SHALL BE LIABLE FOR LOSS OF REVENUE OR PROFITS, FAILURE TO REALIZE SAVINGS OR OTHER BENEFITS, OR FOR ANY OTHER SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES CAUSE BY THE USE, MISUSE, OR INABILITY TO USE THE CALCULATOR, REGARDLESS OF THE LEGAL THEORY ON WHICH THE CLAIM IS BASED, AND EVEN IF CANON U.S.A. OR CANON CANADA HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOR SHALL RECOVERY OF ANY KIND AGAINST CANON U.S.A. OR CANON CANADA BE GREATER IN AMOUNT THAN THE PURCHASE PRICE OF THE CALCULATOR SOLD BY CANON U.S.A. OR CANON CANADA AND CAUSING THE ALLEGED DAMAGE. WITHOUT LIMITING THE FOREGOING, YOU ASSUME ALL RISK AND LIABILITY FOR LOSS. DAMAGE OR INJURY TO YOU AND YOUR PROPERTY AND TO OTHERS AND THEIR PROPERTY ARISING OUT OF USE, MISUSE, OR INABILITY TO USE THE CALCULATOR SOLD BY CANON U.S.A. OR CANON CANADA NOT CAUSE DIRECTLY BY THE NEGLIGENCE OF CANON U.S.A. OR CANON CANADA. (SOME STATES OR PROVINCES DO NOT ALLOW THE EXCLUSION OR LIMITATION OF INCIDENTAL OR CONSEQUENTIAL DAMAGES, SO THE ABOVE LIMITATION OR EXCLUSION MAY NOT APPLY TO YOU) THIS LIMITED WARRANTY SHALL NOT EXTEND TO ANYONE OTHER THAN THE ORIGINAL PURCHASER OF ANY CALCULATOR OR THE PERSON FOR WHOM IT WAS PURCHASED AS A GIFT AND STATES YOUR EXCLUSIVE REMEDY. This warranty gives you specific legal rights, and you may also have other rights. Which vary from state to state or province to province. Canon U.S.A., Inc. One Canon Park, Melville, NY 11747 Canon Canada 6390 Dixie Road, Mississauga, Ontario L5T 1P7 *Canada Canon Consumer Information/Service Centers in the United States For all general inquiries, operational assistance, accessory orders or for the location of the nearest service facility for this product, please contact Canon U.S.A., Inc at 1-800-828-4040. Please keep a copy of your original bill of sale. In order to obtain warranty service, you will need to provide a copy of your original bill of sale from your consumer calculator retailer at the time of service. Also, please keep all packing materials and the original packing box to protect your equipment, should you need to transport it for service. Canon Information/Service Centers in Canada Should service be necessary, please call 1-800-OK-CANON for information regarding the nearest Authorized Service Facility. 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